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Material Specification

Material Specifications

Network PCB Board Material Specifications
Type	Resin	Reinforcement	Glass Transition Temp C	UL Flammability Rating
FR-4	Epoxy	Woven Glass	130 - 140	94V-0
GETEK	Epoxy / polyphenyene oxide	E Glass	175-185	94V-0
BT-Epoxy	Epoxy / Bismaleimide triazine	Glass	180	94V-0
Polyimide	Polyimide	E Glass	250-265	94HB
PTFE	Polytetrafluoroethylene/	E Glass		94V-0
GIL	Polyester	Woven Glass / Glass Paper	120	94V-0
Rogers Bendflex	Epoxy (modified)	Nonwoven polyester & glass	25	94V-0
Kapton	Polyimide	None

Type	Volume Resistivity	Dielectric Constant at 1MHz	Dielectric Strength V/Mil	Dielectric Breakdown kV
FR-4		4.2-4.7	1000-1500
GETEK	>10 6 Mohm/cm	3.6-4.2	1000-1200
BT-Epoxy	10 7 Mohm/cme	4.0	750	94V-0
Polyimide		4.25-4.35	1450
PTFE				>60
GIL	50 8 Mohm/cm	3.86		55
Rogers Bendflex	10 7 Mohm/cm	3.8
Kapton	10 7 Mohm/cm	4.0

Information contained in this data sheet for reference only, and does not constitute any warranty or guarantee.

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