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Material Descriptions

FR-4

FR-404

a multifunctional epoxy system that is used as our standard multilayer material.

FR-406

a Multifunctional Epoxy Laminate and Prepreg that has a Tg of 170 C (DSC). We see FR-406 being used in applications where a higher temperature material is needed. It produces high yields using standard FR-4 processing.

FR-408

a high-performance FR-4 epoxy laminate and prepreg that has a Tg of 180 C (DSC). Its low dielectric constant is an ideal for faster signal speed and improved signal integrity. We recommend this material when layer counts begin to exceed 8 layers because it's higher thermal properties minimize Z-axis expansion and the potential for barrel cracking and pad lifting in complex designs.

GETEK®

family of FR4 grade laminates offer improved electrical and thermal properties ideally suited for sophisticated circuitry and high end applications. A lower and more stable dielectric constant and dissipation factor, higher maximum operating temperatures, higher Tg and lower Z-expansion make this an ideal product for telecommunication, computer and microwave applications.

BT / Epoxy

The blending of bismaleimide / triazine and epoxy resin provides enhanced thermal, mechanical and electrical performance over standard epoxy systems. BT / Epoxy possesses characteristics that make it an excellent selection for larger panel sizes. Advantages such as a high Tg (185C) , Low coefficient of thermal expansion and excellent electrical insulation in high humidity and at higher temperatures make this an good material choice.

Polyimide

This base material system is engineered with an all polyimide resin that is suitable for any electronics that would normally require the ultimate performance of Kerimide 601 ( The past standard polyimide of the industry ). Thermal stability makes this material particularly attractive to applications with stringent high temperature requirements. Low coefficient of thermal expansion of the board provides plated through hole reliability in very high layer counts.

Considerations

Polyimide material is extremely expensive compared to FR4. It's processing is also more difficult, leading to a higher board prices. Alternatives may be BT-epoxy or possibly a high temperature epoxy like FR-406 or FR-408.

PTFE

PTFE / woven glass materials have exceptionally well controlled electrical and mechanical properties. The dielectric constant range is 2.45 to 2.65 and can be specified anywhere within this range with a tolerance of +/- .05. The dissipation factor is approximately .0006 when measured @ 1MHz. Typical applications for TLT laminates include radar systems, phased array antennas, mobile communication systems, microwave test equipment, microwave transmission devices and RF components. Due to the wide range of Dk values and the custom nature of this material, special orders may be necessary.

GIL

Grade MC3D is a composite laminate comprised of woven glass surface sheets on both sides of a glass paper core. MC3D exhibits excellent electricals with a low and stable dielectric constant and dissipation factor. It is an excellent material for high frequency applications or for applications where frequency drift is a concern.

Information on this page is for comparison only. Network PCB, Inc. makes no warranties on the accuracy of this data and assumes no liability arising out of its use by others. Please refer to the manufactures of these materials for more information.