Network PCB

BIB (Burn In Board)

This product is called DUT(Device Under Testing), which is adhered with many sockets to test a large volume of semiconductor devices. This board is used in high temperature, in order to check for defects, by attaching the device to the board in the chamber, where it maintains a constant temperature over 125°C.

Probe Card

The test which is verify for capacity & circuit on high speed, density semiconductor is necessary for Jig with high capacity test so this probe card has role as Jig on test that should be designed with multi Layers connection and impedance on pattern.

Back Plane Board

Have been producing the Mother board with Test board & Performance board on using Main PCB.

High Density Board

The demand for fine and statement technology in increasing rapidly. In this situation, high density, and high speed circuitry PCB is required. We have developed fine line PCB to fit the recent requirement for the PCB, and we are in research to produce developed fine line PCB.

Impedance Control Board

Recent advance in high-speed technology have increased switching time of semiconductor. This PCB model is introduced to operate at faster frequencies. This leads PCB to avoid breakdown, circuit delays, and decreases energy loss. These factors lead to increase layer number.