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Design Guidelines
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| Board features | Materials | Materials Processing | Surface finishes |
| Board Features |
Standard
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Premium
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Advanced
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Future |
| Lines and Spaces (Outer) |
0.006" |
.005"-.003" |
.0025" |
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| Lines and Spaces (Inner) |
0.006" |
.005"-.003" |
.0025" |
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| Outer Annual Ring |
0.007" |
.006"-.004" |
.003" |
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| Inner Annual Ring |
0.007" |
.006"-.004" |
.003" |
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| Hole to Plane Clearance or Conductor |
0.014" |
0.011" |
0.008" |
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Layer to Layer Registration
(Core to Core) |
0.005" |
0.004" |
0.003" |
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Layer to Layer Registration
(Top to Bottom) |
0.005" |
.004"-.003" |
0.002" |
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| PCB Thickness Tolerance |
10% |
9 - 5% |
0.002" |
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| Mechanical Drill Hole Minimum |
0.016" |
.0145"-.008" |
0.006 |
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| Laser Drilled Holes |
0.006" |
0.004" |
0.003" |
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| Controll Depth Drill Aspect Ratio |
0.8:1 |
1:1 |
1:1 |
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| Drill size Aspect Ratio |
7:1 |
8:1 - 10:1 |
11:1 - 15:1 |
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| Controlled Impedance Characteristic |
10% |
9 - 7% |
5% |
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| LPI Soldermask (Dams) |
0.005" |
0.004" |
0.003" |
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| Layer Count |
10 |
12-20 |
up to 40 |
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| Panel Sizes: |
12 X 18 |
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16 X 18 |
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18 X 24 |
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20 X 26 |
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| Maximum Board Thickness |
0.250" |
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| Minimum Board Thickness |
0.010" |
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ONLINE QUOTES |
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Quotation Request:
Please fill out all the information of
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DESIGN GUIDELINES |
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Board features
Materials
Surface Finishes |
| Materials Processing |
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ROAD MAP TECHNOLOGY |
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Board features
Materials
Surface Finishes |
| Materials Processing |
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OUR TEAM |
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Kevin Le
Duy Nhan
Charlie Nguyen
Margaret Bolano
Tony Cooper
Pauline Vo |
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