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Design Guidelines
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| Board features | Materials | Materials Processing | Surface finishes |
| Surface Finishes |
| HASL (Hot Air Solder Leveling) |
| OSP (Organic Solderability Preservative) |
| Immersion Gold (Imm Au) |
| Immersion Silver (Imm Ag) |
| Soft Bondable Gold |
| Electrolytic Hard Gold (Knoop Hardness 120 or >) |
| Soft Electrolytic Gold (Knoop Hardness 90 or <) |
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ONLINE QUOTES |
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Quotation Request:
Please fill out all the information of
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| your PCB requirements. |
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DESIGN GUIDELINES |
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Board features
Materials
Surface Finishes |
| Materials Processing |
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ROAD MAP TECHNOLOGY |
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Board features
Materials
Surface Finishes |
| Materials Processing |
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OUR TEAM |
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Kevin Le
Duy Nhan
Charlie Nguyen
Margaret Bolano
Bobby Jo Nguyen
Pauline Vo
Ben Ngo |
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